Awarded
202122/547 Supply of up to four dry etch and deposition systems
Descriptions
NOTICE OF AWARD OF four dry etch and deposition systems, specifically: •A Deep-Silicon Reactive Ion Etcher (D-RIE) •An Inductively Coupled Plasma-RIE (ICP-RIE) •A parallel plate RIE •A High-Density Plasma-enhanced Chemical Vapour Deposition system (HDP-CVD)
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CPV Codes
22520000 - Dry-etching equipment
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Possible Competitors
1 Possible Competitors