Closed

Automated Multipurpose Wire Bonder

Descriptions

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow exp ....see more

Timeline

Published Date :

9th Apr 2019 in 7 days

Deadline :

8th Jun 2026 in 25 days

Contract Start :

N/A

Contract End :

N/A

Tender Regions

Wales

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

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Workflows

Status :

Closed

Procedure :

N/A

Suitable for SME :

N/A

Nationwide :

N/A

Assign to :

Tender Progress :

Details

Notice Type :

N/A

Tender Identifier :

IT-378-246-T: 2024 - 001

Tenderbase ID :

310724019

Low Value :

£100K

High Value :

£1000K

Buyer Information

Name :

Compound Semiconductor Applications Catapult Ltd

Address :

Liverpool Merseyside , Merseyside , L13 0BQ

Website :

N/A

Procurement Contact

Name :

Tina Smith

Phone :

0151 252 3243

Email :

tina.smith@shared-ed.ac.uk