Closed
GB-LIVERPOOL: Manual Die Placement System for Glueing & Bump Bonding
Descriptions
Tender for the supply of a die bonding system suitable for the glueing of silicon dies with epoxy and filled anisotropically conductive glues as well as for bump bonding with Indium, PbZn and AgZn solder balls. The system will be housed in the Liverpool Semiconductor Detector Centre (LSDC), Department of Physics, University of Liverpool.
Timeline
Published Date :
7th Jan 2016
9 years ago
Deadline :
19th Jan 2016
9 years ago
Contract Start :
1st Mar 2016
Contract End :
31st Aug 2016
Tender Regions
CPV Codes
Workflows
Status :
Closed
Assign to :
Tender Progress :
Details
Notice Type :
Open opportunity
Tender Identifier :
IT-378-246-T: 2024 - 001
TenderBase ID :
310724019
Low Value :
£100K
High Value :
£1000K
Region :
North Region
Attachments :
Buyer Information
Address :
Liverpool Merseyside , Merseyside , L13 0BQ
Website :
N/A
Procurement Contact
Name :
Tina Smith
Designation :
Chief Executive Officer
Phone :
0151 252 3243
Email :
tina.smith@shared-ed.ac.uk
Possible Competitors
1 Possible Competitors
