Awarded

GB-Middlesbrough: SME InnovaTIon Accelerator (TIA), ERDF funded

Descriptions

This is ERDF funded. A.Microfabrication Station UV Lamp: 365nm, Automated loading of wafer and exposure, adjustable power up to 44mW/cm2. Include virgin glass 5inches mask for ....see more

Timeline

Published Date :

22nd Sep 2022 3 years ago

Deadline :

21st Sep 2022 3 years ago

Contract Start :

23rd Sep 2022

Contract End :

31st May 2023

Tender Regions

CPV Codes

31712330 - Semiconductors

Keywords

IC chip

wafer chip

semiconductor device

power semiconductor

integrated semiconductor

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Workflows

Status :

Awarded

Procedure :

AcceleratedNegotiated

Suitable for SME :

Yes

Nationwide :

No

Assign to :

Tender Progress :

0%

Details

Notice Type :

Tender

Tender Identifier :

IT-378-246-T: 2024 - 001

Tenderbase ID :

310724019

Low Value :

£100K

High Value :

£1000K

Buyer Information

Address :

Liverpool Merseyside , Merseyside , L13 0BQ

Website :

N/A

Procurement Contact

Name :

Tina Smith

Phone :

0151 252 3243

Email :

tina.smith@shared-ed.ac.uk