Awarded
Open Air Diffusion Bonding Technology
Descriptions
The open-air diffusion bonding technology presents a unique approach to manufacture of large-scale tungsten components. Unlike both traditional and advanced methods, this technique eliminates the need for vacuum conditions or tightly controlled atmospheres, thereby offering a more scalable and cost-effective solution for industrial applications.
7-month project for continuation of technical work that will further the Intellectual Property application related to open air diffusion bonding technology for fusion application.
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