Plasma Enhanced Atomic Layer System.

Descriptions

The University has appointed a Contractor or Contractors to supply a Plasma Enhanced Atomic Layer Deposition System. Part of the facilities for the National Graphene Institute (NGI), the equipment will be located in a dedicated area within a class 1000 cleanroom environment within the NGI. We require the system to be single wafer load locked and provide the range of low-temperature (less than 300 °C) deposition processes given in the detailed requirements. This system must be capable of loading wafers up to 100 mm. The system should also be capable of processing smaller wafers down to 50 mm diameter and piece parts of 22 mm x 25 mm and 10 mm x 10 mm and the cost of any additional clamps or holders should be included.The system must be fully installed and commissioned into the NGI facility by December 2014.