Awarded
Precision Milling/Grinding/Polishing System
Descriptions
A system that enables precise thinning of silicon die of integrated circuits. The system must allow the user to accurately control the thickness of the resulting die within a few microns. The silicone is required to be thinned uniformly to give a consistent thickness across the device whilst keeping the Device under test (DUT) electronically functional.
Timeline
Published Date :
25th Oct 2019
5 years ago
Deadline :
N/A
Tender Awarded :
1 Supplier
Awarded date :
23rd Oct 2019
Contract Start :
N/A
Contract End :
N/A
Tender Regions
CPV Codes
42623000 - Milling machines
Workflows
Status :
Awarded
Assign to :
Tender Progress :
Details
Notice Type :
Open opportunity
Tender Identifier :
IT-378-246-T: 2024 - 001
TenderBase ID :
310724019
Low Value :
£100K
High Value :
£1000K
Region :
North Region
Attachments :
Buyer Information
Address :
Liverpool Merseyside , Merseyside , L13 0BQ
Website :
N/A
Procurement Contact
Name :
Tina Smith
Designation :
Chief Executive Officer
Phone :
0151 252 3243
Email :
tina.smith@shared-ed.ac.uk
Possible Competitors
1 Possible Competitors
