Awarded
Quantum Technology Device Bonding Machine.
Descriptions
We wish to purchase a specialist device bonding machine for work on an EPSRC funded project (UK Quantum Technology Hub in Quantum Enhanced Imaging). We require this machine for the alignment (with micron accuracy) and bonding of millimetre sized components (e.g. semiconductor chips and glass substrates approximately 5 x 5 x 0,5 mm in size). Depending on tendered prices, the University will consider options for a machine to do room temperature bonding, and alternatively 1 with heating elements. The heating capability may be a useful option for future work, but is not essential for the bonding work currently planned. Bid prices should include the cost of supply, delivery, installation and on-site training. Ideally we would like a 2 year warranty extension, budget permitting.
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Possible Competitors
1 Possible Competitors
