Semi-Automatic Wire Bonder

Descriptions

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we are looking to increase our capacity with wire bonding. We currently have a Hesse BJ653 with five bondheads to provide the capability to bond in a variety of applications. This includes fine wire bonding - ball-wedge, wedge-wedge and stud bumping using gold and aluminium wires. There are heavy wire and ribbon capabilities too with aluminium and copper bondwire. While the flexibility of this platform is inline with our current and future requirements it has also become a bottle neck as a number of CR&D projects and commercial activities require access to the system. The Compound Semiconductor Applications Catapult intends to purchase a semi-automatic wire bonder for use at the Advanced Packaging Laboratory at the Innovation Centre in Newport. This will increase capacity and provide additional flexibility to our scheduling for project and commercial activities. The estimated budget range for the contract is £40,000 - £60,000. This is the estimated maximum value covering related future services and options. The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by January 2021.