Closed
UCAM 068/16 (2) UHV Process Suite — Automated sputter deposition system.
Descriptions
As part of a major research activity on novel low energy electronics we wish to sputter deposit thin film heterostructures on substrates up to 4" in diameter with precise layer thickness control and high run to run reproducibility. We require the capability of depositing metals, oxide and nitrides using automated deposition sequences reproducibly depositing layers with thicknesses down to below one nanometre thickness.
Timeline
Published Date :
Deadline :
Contract Start :
Contract End :
Tender Regions
CPV Codes
71900000 - Laboratory services
45214630 - Scientific installations
51430000 - Installation services of laboratory equipment
71350000 - Engineering-related scientific and technical services
Keywords
scientific installation construction
specialist research infrastructure
experimental apparatus facility
science infrastructure construction
laboratory apparatus installation
pipette calibration device installation
chromatography equipment fitting
chemical analysis device integration
scientific engineering services
technical engineering supporting services
engineering science consultancy
engineering laboratory services
technical research for engineering
engineering validation services
specialist technical solutions
Workflows
Status :
Assign to :
Tender Progress :
Details
Notice Type :
Tender Identifier :
TenderBase ID :
Low Value :
High Value :
Region :
Attachments :
Buyer Information
Address :
Website :
Procurement Contact
Name :
Designation :
Phone :
Email :
Possible Competitors
1 Possible Competitors
