Awarded
UCAM 068/16 (2) UHV Process Suite — Automated sputter deposition system.
Descriptions
As part of a major research activity on novel low energy electronics we wish to sputter deposit thin film hetero-structures on substrates up to 4" in diameter with precise layer thickness control and high run to run reproducibility. We require the capability of depositing metals, oxide and nitrides using automated deposition sequences reproducibly depositing layers with thicknesses down to below 1 nanometre thickness.
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71900000 - Laboratory services
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1 Possible Competitors
