Closed
UCC/2021/24 - Optical Fiber Array and Micro-lens Packaging Equipment
Descriptions
The photonic Packaging Group and the Tyndall Institute is seeking to purchase equipment to package optical components, specifically optical fibre and micro-optical components to photonic devices such as Photonic Integrated Circuits (PICs). These PIC devices include Silicon (Si), Indium Phosphide (InP) and Silicon Nitride (SiN) type photonic devices.
Timeline
Published Date :
Deadline :
Contract Start :
Contract End :
Tender Regions
CPV Codes
31712100 - Microelectronic machinery and apparatus
38000000 - Laboratory, optical and precision equipments (excl. glasses)
42921320 - Packaging machines
31712000 - Microelectronic machinery and apparatus and microsystems
Tender Lot Details
1 Tender Lot
Workflows
Status :
Assign to :
Tender Progress :
Details
Notice Type :
Tender Identifier :
TenderBase ID :
Low Value :
High Value :
Region :
Attachments :
Buyer Information
Address :
Website :
Procurement Contact
Name :
Designation :
Phone :
Email :
Possible Competitors
1 Possible Competitors