UCC/2022/02 - Request for Tenders under Open (OJEU) Procedure for the Supply, Delivery and Installation of a Broad Ion Beam Milling System for SP&S for the Tyndall National Institute, UCC

Descriptions

The Specialty Products & Services Group (SP&S) at Tyndall National Institute, UCC, fabricate a wide variety of Semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. In addition, SP&S provide an extensive array of analysis services in all types of electronic devices and packages to internal and external customers. The Electron Microscopy and Analysis Facility (EMAF) within SP&S utilise a wide range of SEM, TEM and FIB equipment as part of these analysis services. We wish to extend our capability in the area of sample preparation by purchasing a fully functional Broad Ion Beam (BIB) milling system with an ancillary mechanical polishing system which will allow us to bridge a sample cross-section preparation gap between our existing plasma FIB and mechanical methods