UK SBS PR19072 Flip Chip Aligner

Descriptions

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) develop detectors to cover a broad range of scientific measurement in the X-Ray, infrared, visible light, neutron, gamma ray parts of the EM spectrum. UKRI-STFC require a flip chip bonder which will perform the assembly of such a range of radiation sensitive detectors. The detectors generally consist of a 2D array of complementary metal oxide semiconductor (CMOS) readout integrated circuit (ROIC), bonded to a geometrically similar 2D array of solid-state sensor material to form a hybrid pixel sensor. In many cases, the ROIC is silicon, but often the sensor is selected to provide specific detection properties for the radiation range being sensed. This means that a wide variety of sensor materials are possible, including but not limited to silicon, germanium, cadmium telluride, cadmium zinc telluride, gallium arsenide and gallium antimonide. Most of the projects are small volume (1-5 units), high value runs, but it is also required to perform higher volume assemblies of a few 10s, 100s or potentially 2000-3000 units. Small volume runs must be accommodated by creating breaks during larger runs, necessitating rapid turn reconfigurations. The assembly facility is currently going through a major upgrade and will be moving into new custom built premises and looking to build on that improvement by enhancing the bonding and assembly capabilities. Floor space has been allocated with service provision installed for a typical flip chip bonder. UKRI-STFC has an established flip chip and die placement capability which utilises a range of bond processes but there is a recognised need to future proof the assembly infrastructure, increase the capacity and provide for making process enhancements to enable assembling higher numbers of more densely packed pixels. There are also plans to extend the range of processes which can be supported in the future, giving the ability to offer more than the current core flip chip processes. Please refer to the specification for the full requirement.