UK SBS PR19072 Flip Chip Aligner

Descriptions

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) develop detectors to cover a broad range of scientific measurement in the X-Ray, infrared, visible light, neutron, gamma ray parts of the EM spectrum. UKRI-STFC require a flip chip bonder which will perform the assembly of such a range of radiation sensitive detectors. The detectors generally consist of a 2D array of complementary metal oxide semiconductor (CMOS) readout integrated circuit (ROIC), bonded to a geometrically similar 2D array of solid-state sensor material to form a hybrid pixel sensor. In many cases, the ROIC is silicon, but often the sensor is selected to provide specific detection properties for the radiation range being sensed. This means that a wide variety of sensor materials are possible, including but not limited to silicon, germanium, cadmium telluride, cadmium zinc telluride, gallium arsenide and gallium antimonide. Please refer to the tender documents for the full specification.