UK SBS RE17006 14-Layer PCB Interposer

Descriptions

The final date and time for the submission of bids is Wednesday 1st of February 2017 at 11:00am. DO NOT apply directly to the buyer. All tender information MUST be submitted through the CCS eSourcing Portal. Brief Description of Requirement This requirement is for a 14-layer printed circuit board (PCB) style interposer constructed using high-density interconnect build-up technology from ultra-thin PCB laminates. Its purpose is to connect a 6400 pin HEXITEC processor chip on one side of the interposer to a 6400 pin-pin HEXITEC CZT detector on the other side. Please ensure you review all attached information to ensure a full understanding of this requirement. All attachments can be found with the RFx attachments tab within the Emptoris System. This contract will be awarded based on the evaluation criteria set out in the ITQ document. How to Apply As part of the strategic alliance between UK Shared Business Services Ltd (UK SBS) and Crown Commercial Service (CCS), UK SBS will be using the CCS eSourcing Suite for this procurement. To register on the CCS eSourcing portal please follow the details contained within the Additional Information section of this notice. If you are already registered on the CCS eSourcing portal and wish to register your interest in this opportunity please email; expressionofinterest@crowncommercial.gov.uk Your email must clearly state: •the name and reference for the procurement you wish to register for; •the name of the registered Bidder; •the name and contact details for the registered individual sending the email.