Awarded

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

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Descriptions

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

Timeline

Published Date :

16th Feb 2024 1 year ago

Deadline :

N/A

Tender Awarded :

1 Supplier

Awarded date :

13th Feb 2024

Contract Start :

N/A

Contract End :

N/A

Tender Regions

Wales

CPV Codes

31712000 - Microelectronic machinery and apparatus and microsystems

Keywords

microelectronic machinery

microsystems apparatus

semiconductor equipment

wafer fabrication machine

microtool

Tender Lot Details

2 Tender Lots

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Workflows

Status :

Awarded

Procedure :

N/A

Suitable for SME :

N/A

Nationwide :

Assign to :

Tender Progress :

Details

Notice Type :

CONTRACT

Tender Identifier :

IT-378-246-T: 2024 - 001

Tenderbase ID :

310724019

Low Value :

£100K

High Value :

£1000K

Buyer Information

Name :

UK Research and Innovation

Address :

Liverpool Merseyside , Merseyside , L13 0BQ

Website :

N/A

Procurement contact

Name :

Tina Smith

Phone :

0151 252 3243

Email :

tina.smith@shared-ed.ac.uk

Possible Competitors

1 Possible Competitors