Closed

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

Descriptions

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

Timeline

Published Date :

21st Feb 2024 in a 10 months

Deadline :

19th Jan 2024 in a 11 months

Contract Start :

9th Feb 2024

Contract End :

8th Feb 2025

Tender Regions

South East

CPV Codes

31712000 - Microelectronic machinery and apparatus and microsystems.

Tenderbase Categories

Electronics/ Microelectronic/ Magnetic and Optical Readers/ Radio and Television/

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Workflows

Status :

Closed

Assign to :

Tender Progress :

Details

Notice Type :

Open opportunity

Tender Identifier :

IT-378-246-T: 2024 - 001

TenderBase ID :

310724019

Low Value :

£100K

High Value :

£1000K

Region :

North Region

Attachments :

020044-2024.pdf

Buyer Information

Name :

The City of Liverpool College

Address :

Liverpool Merseyside , Merseyside , L13 0BQ

Website :

N/A

Procurement Contact

Name :

Tina Smith

Designation :

Chief Executive Officer

Phone :

0151 252 3243

Email :

tina.smith@shared-ed.ac.uk

Possible Competitors

1 Possible Competitors