Awarded
Wafer Dicing Saw and Post Wafer Cleaning
Descriptions
The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonics and Advanced Manufacturing.This system is a replacement for the current dicing saw for Building 53 back-end of line cleanroom facility and an upgrade to meet the demands of current projects and technologies. Dicing is a fundamental part of the cleanroom and underpins a significant number of ongoing and future grants. The acquisition of this system will enable university researchers to machine surfaces and micron sized ridge structures with nanoscale surface roughness and low amounts of topside chipping in optical and semiconductor materials.This dicing machine will allow the fabrication of new devices that will tackle fundamental research problems in quantum light-matter interactions, quantum sensors, and telecommunications.
Timeline
Published Date :
Deadline :
Tender Awarded :
Awarded date :
Contract Start :
Contract End :
Tender Regions
South East
CPV Codes
38000000 - Laboratory, optical and precision equipments (excl. glasses)
Keywords
laboratory instruments
precision apparatus
scientific measuring devices
analytical equipment
optical tools
research lab gear
calibration instruments
microscopy tools
spectrometry units
Tender Lot Details
2 Tender Lots
Workflows
Status :
Assign to :
Tender Progress :
Details
Notice Type :
Tender Identifier :
TenderBase ID :
Low Value :
High Value :
Region :
Attachments :
Buyer Information
Address :
Website :
Procurement Contact
Name :
Designation :
Phone :
Email :
Possible Competitors
1 Possible Competitors
