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UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Component ....
Buyer : UK Research & Innovation
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Component ....
Buyer : uk research & innovation
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Component ....
Buyer : bip solutions limited
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Component ....
Buyer : UK Research & Innovation
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
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