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Awarded

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Component ....

Buyer : UK Research & Innovation

location icon Wales
tag icon N/A
No of lots : N/A
Tender Id : 1602240118
Published : 16th Feb 2024

Descriptions

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

Awarded

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Component ....

Buyer : uk research & innovation

location icon South East
tag icon N/A
No of lots : N/A
Tender Id : 1502240060
Published : 15th Feb 2024

Descriptions

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

Closed

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Component ....

Buyer : bip solutions limited

location icon South East
tag icon N/A
No of lots : N/A
Tender Id : 2102240288
Type of Contract : Contract
Published : 21st Feb 2024
Deadline : 19th Jan 2024

Descriptions

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

Closed

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Component ....

Buyer : UK Research & Innovation

location icon Wales
tag icon £180K
No of lots : N/A
Tender Id : 1012230065
Type of Contract : Contract
Published : 10th Dec 2023
Deadline : 19th Jan 2024

Descriptions

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

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