Awarded
NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
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Descriptions
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
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Tender Regions
CPV Codes
31712330 - Semiconductors
Keywords
semiconductor device
integrated semiconductor
IC chip
power semiconductor
wafer chip
Tender Lot Details
2 Tender Lots
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Possible Competitors
1 Possible Competitors
