Awarded
NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
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Descriptions
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to s ....see more
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Tender Regions
CPV Codes
31712330 - Semiconductors
Keywords
IC chip
wafer chip
semiconductor device
power semiconductor
integrated semiconductor
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