Awarded
Supply, Delivery and Commissioning of a Ball Bonder
Descriptions
This equipment will be used to enhance delivery of electro-photonic microsystems in a number of major projects, including EPSRC Platform and Programme Grants, Phase 2 Quantum Technology Hubs, and an RAEng Chair in Emerging Technologies. The capabilities added by the equipment will be essential to produce high-density electrical interconnects of two distinct types: pad-to-pad wire bonds with wire diameters below 20 microns if required, and two-dimensional bump bond arrays. In the latter case, the ball bonder will be used in a two-stage process, in which it produces arrays of metal bumps on one component subsequently assembled with a second component.
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CPV Codes
31600000 - Electrical equipment and apparatus
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Possible Competitors
1 Possible Competitors
