Open Closing in a 9 months
Supply, Delivery and Installation Sinter Bonding Capability
Descriptions
National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.
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Keywords
optical tools
microscopy tools
precision apparatus
spectrometry units
calibration instruments
laboratory instruments
research lab gear
analytical equipment
scientific measuring devices
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1 Tender Lots
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