Open Closing in a 1 year
Supply, Delivery and Installation Sinter Bonding Capability
Descriptions
National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements.
A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.
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Keywords
laboratory instruments
precision apparatus
scientific measuring devices
analytical equipment
optical tools
research lab gear
calibration instruments
microscopy tools
spectrometry units
Tender Lot Details
2 Tender Lots
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Possible Competitors
1 Possible Competitors
