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Thermal Imaging IR Camera System
Descriptions
The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides capability to demonstrate feasibility and undertake small volume prototype builds. As a part of the package assembly research and development methodology, we require an IR thermal imaging system to validate compound semiconductor-based package/module/PCB thermal designs and potentially to test materials. The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by March 2021.
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CPV Codes
38000000 - Laboratory, optical and precision equipments (excl. glasses)
31720000 - Electromechanical equipment
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Possible Competitors
1 Possible Competitors
