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Awarded

Die Bonder

Buyer : Compound Semiconductor Applications Catapult Ltd

location icon Wales
tag icon £146K
No of lots : N/A
Tender Id : 1610190237
Published : 16th Oct 2019

Descriptions

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, photonics, and power compound semiconductor devices, modules and systems. This would allow exp ....

Awarded

Die Bonder

Buyer : Compound Semiconductor Applications Catapult

location icon Any region
tag icon £180K
No of lots : N/A
Tender Id : 2607190099
Published : 26th Jul 2019

Descriptions

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow exp ....

Closed

Die Bonder

Buyer : Compound Semiconductor Applications Catapult Ltd

location icon Wales
tag icon £180K
No of lots : N/A
Tender Id : 0904190002
Type of Contract : Contract
Published : 9th Apr 2019
Deadline : 7th May 2019

Descriptions

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow exp ....

Closed

Die Bonder

Buyer : Compound Semiconductor Applications Catapult

location icon Any region
tag icon £180K
No of lots : N/A
Tender Id : 0604190122
Type of Contract : Contract
Published : 5th Apr 2019
Deadline : 7th May 2019

Descriptions

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow exp ....

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