Find Die Bonder Tenders in the UK – Latest Public Sector Contracts

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The Provision of Ash Die Back Tree Felling Services

Buyer : Leeds City Council

Yorkshire and The Humber

No of lots : 1

Tender Id : 1205250194

Type of Contract : PIN

Published : 12th May 2025

Deadline : 12th May 2026

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Descriptions

The Provision of Ash Die Back Tree Felling services alongside public highways, within parks, open spaces, country estates and private grounds. Services provided under this arrangement will include removal of ash trees that show the worst signs of inf ....

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Supply and Deliver of a Top Spacer Assembly for a 2000 Ton Hydraulic Press for t ....

Buyer : University of Strathclyde

Scotland

No of lots : N/A

Tender Id : 1203200052

Type of Contract : Tender

Published : 11th Mar 2020

Deadline : N/A

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Descriptions

After ten years of operation the Advanced Forming Research Centre (AFRC) is now globally recognised as a Centre of excellence in metal forming and forging research, manufacturing technology and innovation. This is evidenced by an international corpor ....

Awarded

Provision of Die Bonder

Buyer : University of Glasgow

Scotland

No of lots : 1

Tender Id : 2406250326

Published : 24th Jun 2025

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Descriptions

Award of PURCH2611 Provision of Die Bonder

Awarded

Die Bonder

Buyer : Compound Semiconductor Applications Catapult Ltd

Wales

No of lots : N/A

Tender Id : 1610190237

Published : 16th Oct 2019

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Descriptions

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, photonics, and power compound semiconductor devices, modules and systems. This would allow exp ....

Awarded

Die Bonder

Buyer : Compound Semiconductor Applications Catapult

Any region

No of lots : N/A

Tender Id : 2607190099

Published : 26th Jul 2019

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Descriptions

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow exp ....

Awarded

PPE1001471 Direct award for the Provision of PDP Wire Bonder

Buyer : University of Glasgow

Scotland

No of lots : N/A

Tender Id : 0204240015

Published : 2nd Apr 2024

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Descriptions

PPE1001471 Direct award for the Provision of PDP Wire Bonder. Replicating capability in GLADD Lab at the School of Physics. Negotiated access to their F&S Bondtec 56xxi Bonder, trained staff on using the machine. Unfortunately, the bonder in Physics ....

Awarded

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Component ....

Buyer : UK Research & Innovation

Wales

No of lots : N/A

Tender Id : 1602240118

Published : 16th Feb 2024

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Descriptions

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

Awarded

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Component ....

Buyer : uk research & innovation

South East

No of lots : N/A

Tender Id : 1502240060

Published : 15th Feb 2024

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Descriptions

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

Awarded

Ash Die Back Remedial Works

Buyer : leicestershire county council

North East+ 11 more

No of lots : N/A

Tender Id : 1501240102

Published : 15th Jan 2024

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Descriptions

Ash Die Back Remedial Works - Provision of Maintenance/Felling/Clearance of Ash Tree Infected with Hymenoscyphus Fraxineus (Ash Die Back). The Award of the contract is via a Further Competition through DPS YPS 000881 Ground Maintenance and Associated ....

Awarded

Supply, Delivery and Commissioning of a Ball Bonder

Buyer : University of Strathclyde

Scotland

No of lots : N/A

Tender Id : 2212230018

Published : 22nd Dec 2023

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Descriptions

This equipment will be used to enhance delivery of electro-photonic microsystems in a number of major projects, including EPSRC Platform and Programme Grants, Phase 2 Quantum Technology Hubs, and an RAEng Chair in Emerging Technologies. The capabilit ....

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