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Prior Information notice - Cryogenic Probe Station

Buyer : National Physical Laboratory

location icon London
tag icon £225K
No of lots : N/A
Tender Id : 1308200087
Type of Contract : PIN
Published : 13th Aug 2020
Deadline : N/A
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Descriptions

The National Physical Laboratory [NPL] requirement is for a new cryogenic probe station for measurements of superconducting circuits. The new system should have a demonstrated capability to perform low-noise DC and microwave measurements (up to at le ....

Awarded

12inch mask and wafer semiconductor processing

Buyer : UK Research & Innovation

location icon South East
tag icon N/A
No of lots : 1
Tender Id : 1103250005
Published : 11th Mar 2025

Descriptions

12inch mask and wafer semiconductor processing

Awarded

Supply, Delivery and Installation of wafer dicing kit for NMIS

Buyer : University of Strathclyde

location icon Scotland
tag icon N/A
No of lots : 1
Tender Id : 1601250003
Published : 16th Jan 2025

Descriptions

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends t ....

Awarded
Descriptions

The Process & Product Development laboratories at Tyndall National Institute, UCC, fabricate a wide variety of Semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. Wish to extend our cap ....

Awarded

PURCH1105 Provision of a single wafer spray cleaning tool and a single wafer res ....

Buyer : University of Glasgow

location icon Wales
tag icon £350.51K
No of lots : N/A
Tender Id : 2102150108
Published : 21st Feb 2015

Descriptions

PURCH1105 Provision of a single wafer spray cleaning tool and preventative maintenance — Lot 1 and Provision of a single wafer resist coating tool and preventative maintenance — Lot 2.Lot 1:The James Watt Nanofabrication Centre in the School of E ....

Awarded

Wafer Scale Engine Processors

Buyer : University Of Edinburgh

location icon Scotland
tag icon N/A
No of lots : 1
Tender Id : 1701250048
Published : 17th Jan 2025

Descriptions

Purchase of 4 wafer scale processors and coolant distribution unit. Purchase includes supply of hardware, delivery, installation and 3 years' support, warranty and maintenance from install.

Awarded

3.3KV SiC MOSFET devices fabrication - AWARD

Buyer : The University of Warwick

location icon West Midlands
tag icon £245.61K
No of lots : N/A
Tender Id : 1612240406
Published : 16th Dec 2024

Descriptions

The University of Warwick has a requirement to purchase foundry services from a dedicated Silicon Carbide Wafer foundry (combining process integration and manufacturing capabilities) for SiC Devices fabrication and processing. The required service wi ....

Awarded

3.3KV SiC MOSFET devices fabrication

Buyer : University of Warwick

location icon West Midlands
tag icon N/A
No of lots : 1
Tender Id : 1612240513
Published : 16th Dec 2024

Descriptions

The University of Warwick has a requirement to purchase foundry services from a dedicated Silicon Carbide Wafer foundry (combining process integration and manufacturing capabilities) for SiC Devices fabrication and processing. The required service wi ....

Awarded

200mm Capable High Resolution Imaging Equipment

Buyer : UNIVERSITY OF SOUTHAMPTON

location icon South East
tag icon £1.45M
No of lots : N/A
Tender Id : 2711240093
Published : 27th Nov 2024

Descriptions

The University of Southampton Zepler Cleanrooms were looking to purchase in a 200mm wafer capable, ultra-high resolution scanning electron microscope (UHR-SEM). The equipment will deliver efficient fabrication at the wafer scale, process waste reduct ....

Awarded

Laser microlithography equipment

Buyer : UNIVERSITY OF SALFORD(THE)

location icon North West+ 14 more
tag icon £135K
No of lots : N/A
Tender Id : 1309240020
Published : 13th Sep 2024

Descriptions

The University of Salford is looking to procure laser microlithography equipment that satisfies the following technical requirements: •Be able to use ultraviolet light to create bespoke patterns on the surface of a wafer or chip •Be able to handl ....

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