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This Framework is for the Supply and Delivery of Electronic Components, Tools and Associated Products to all Schools and Directorates within Queen’s University Belfast Queen’s. These products will be for the general University and deliver ....

This second award notice concludes the award of suppliers to the framework agreement.NWUPC is seeking to establish a multi-provider Framework Agreement for Electronic Components and Associated Products. The Framework Agreement will be split into 5 lo ....

This second award notice concludes the award of suppliers to the framework agreement. NWUPC is seeking to establish a multi-provider Framework Agreement on behalf of the members of NWUPC, NEUPC, LUPC, SUPC, APUC, HEPCW and CPC for Electronic Componen ....

Please note that the contract conclusion is still to be finalised with further supplier(s) on Lots 1, 2, 3, 4 and 5. Once the contract(s) are concluded, a further contract award notice will be published. NWUPC is seeking to establish a multi-provider ....

NWUPC is seeking to establish a multi-provider Framework Agreement for Electronic Components and Associated Products. The Framework Agreement will be split into 5 lots as follows:Lot 1 – Electronic Components including Development Boards and Associ ....

The Ministry of Defence (the Authority) has awarded a Single Source Contract with Ultra PCS Limited with a duration of 7 years for the Repair and Refurbishment of Optical Electrical and Electronic Components and Associated Assemblies. Please note, th ....

This is a call to competition by Iarnród Éireann (IÉ) for the procurement of Electronic Equipment Repair and Support Services. Iarnród Éireann (IÉ) operate an electronic component repair facility in Drogheda, Co. Louth. This facility repairs OE ....

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

***Please note this is an award notice, not a call for competition*** UK Research and Innovation (UKRI) had a requirement for Electronic Components. This procurement has been concluded via a Competitive Quotation (below threshold)