Closed

Die Bonder

Descriptions

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow ex ....see more

Timeline

Published Date :

5th Apr 2019 in 7 days

Deadline :

8th Jun 2026 in 25 days

Contract Start :

24th May 2019

Contract End :

23rd May 2022

Awarded Tender :

Die Bonder

Published Date :

26th Jul 2019

Tender Regions

Channel Islands East Midlands East of England England Isle of Man London North East North West Northern Ireland Scotland South East South West Wales West Midlands Yorkshire and The Humber

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

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Workflows

Status :

Closed

Procedure :

N/A

Suitable for SME :

N/A

Nationwide :

N/A

Assign to :

Tender Progress :

Details

Notice Type :

N/A

Tender Identifier :

IT-378-246-T: 2024 - 001

Tenderbase ID :

310724019

Low Value :

£100K

High Value :

£1000K

Buyer Information

Name :

Compound Semiconductor Applications Catapult

Address :

Liverpool Merseyside , Merseyside , L13 0BQ

Website :

N/A

Procurement Contact

Name :

Tina Smith

Phone :

0151 252 3243

Email :

tina.smith@shared-ed.ac.uk