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UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

This equipment will be used to enhance delivery of electro-photonic microsystems in a number of major projects, including EPSRC Platform and Programme Grants, Phase 2 Quantum Technology Hubs, and an RAEng Chair in Emerging Technologies. The capabilit ....

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

This equipment will be used to enhance delivery of electro-photonic microsystems in a number of major projects, including EPSRC Platform and Programme Grants, Phase 2 Quantum Technology Hubs, and an RAEng Chair in Emerging Technologies. The capabilit ....