Find public sector tenders

***THIS IS AN AWARD NOTICE, NOT A CALL FOR COMPETITION *** This procurement is being concluded following a competitive quote exercise.

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium me ....

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium me ....

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium me ....

Cardiff University, School of Biosciences requires 6 epitaxial wafers of In(Ga)As (Indium Gallium Arsenide) quantum dots emitting at 1300nm embedded in a AlGaAs (Aluminium Gallium Arsenide)/GaAs (Gallium Arsenide).The wafers will be used for the fabr ....

Proposals are invited that shall investigate the performance of reactive ion etching (RIE) or other similar techniques to create moth-eye style anti reflective structures on MWIR focal plane arrays for performance enhancement and decreased surface re ....

We require custom-built IR detector using superlattice technology with ultra-specialised Molecular Beam epitaxy. This is required by CLF in order to carry out groundbreaking work on the effects of new pharmaceutical drugs within the body. By doing th ....

Cardiff University, School of Biosciences intends to purchase 6 epitaxial wafers of In(Ga)As (Indium Gallium Arsenide) quantum dots emitting at 1300nm embedded in a AlGaAs (Aluminium Gallium Arsenide)/GaAs (Gallium Arsenide) for the research activity ....

The photonic Packaging Group and the Tyndall Institute is seeking to purchase equipment to package optical components, specifically optical fibre and micro-optical components to photonic devices such as Photonic Integrated Circuits (PICs). These PIC ....

Tender for the supply of a die bonding system suitable for the glueing of silicon dies with epoxy and filled anisotropically conductive glues as well as for bump bonding with Indium, PbZn and AgZn solder balls. The system will be housed in the Liverp ....